Product Data Sheet Show all documents

SikaBond® T-8

1-component adhesive for waterproofing.

SikaBond® T-8 is a 1-component adhesive for waterproofing.

  • Fast curing
  • Waterproofing and bonding with only one product
  • Builds a waterproof layer
  • Adhesion to various substrates
  • Elastic, footfall sound-dampening properties
  • Suitable for bonding directly onto old ceramic tiles
  • Reduces of stress transfer between tiles and the substrate
Find a Store
Product Data Sheet Show all documents

Usage

SikaBond® T-8 is designed for waterproofing tile floors on balconies and terraces, in loggias, kitchens, bathrooms and other areas exposed to water.  

Advantages

  • Fast curing
  • Waterproofing and bonding with only one product
  • Builds a waterproof layer
  • Adhesion to various substrates
  • Elastic, footfall sound-dampening properties
  • Suitable for bonding directly onto old ceramic tiles
  • Reduces of stress transfer between tiles and the substrate

Packaging

10 l metal pail

Colour

Beige

Product Details

Sustainability / Certifications / Approvals

APPROVALS / STANDARDS

  • DIN EN 14891
Product Information

Chemical Base

Polyurethane

Shelf Life

SikaBond® T-8 has a shelf life of 12 months from the date of production, if it is stored properly in undamaged, original, sealed packaging, and if the storage conditions are met.

Storage Conditions

SikaBond® T-8 shall be stored in dry conditions, protected from direct sunlight and at temperatures between +5 °C and +25 °C.

Density

1.35 kg/l approx.

(ISO 1183-1)
Technical Information

Shore A Hardness

35 approx. (after 28 days)

(ISO 868)

Tensile Strength

1.5 N/mm2 approx.

(ISO 37)

Shear Strength

1.0 N/mm2, 1mm adhesive thickness

(EN 1465)

Service Temperature

−40 °C to +70 °C

 

 

Application

Application Information

Sag Flow

SikaBond® T-8 spreads easily and maintains stable trowel marks.

Ambient Air Temperature

+5 °C to +35 °C, min. 3 °C above dew point temperature

Relative Air Humidity

30% to 90%

Substrate Temperature

+5 °C to +35 °C

Substrate Moisture Content

Permissible substrate moisture content without Sika® Primer MB (standard application):

  • < 6% CM

Permissible substrate moisture content with Sika® Primer MB (as an additional waterproofing membrane):

  • < 4% CM

Curing Rate

4 mm/24 hours approx. (23 °C / 50% r.h.)

(CQP 049-2)

Skin Time / Laying Time

45 minutes approx. (23 °C / 50% r.h.)

(CQP 019-1)
Consumption

Consumption

SikaBond® T-8 is applied in two layers. The first layer is for waterproofing, the second layer for bonding.

Waterproofing layer:

  • 2.0−2.7 kg/m2 approx. with metal trowel, in a layer about 2 mm thick

Bonding layer:

  • 1.5 kg/m2 approx. with a notched trowel (notches min. 4x4 mm / min. trowel C1)

For substrates primed with Sika® Primer MB, the consumption of SikaBond® T-8 may be reduced.
Application steps

SUBSTRATE PREPARATION

  • The substrate must be clean, dry, sound and homogeneous, free from oils, grease, dust and loose or friable particles. Paint, cement laitance and other poorly adhering contaminants must be removed.
  • Concrete and/or cement screeds must be ground and thoroughly cleaned with an industrial vacuum.
  • Anhydrite screeds, including flowable anhydrite screeds must be ground and thoroughly cleaned with an industrial vacuum shortly before bonding with the adhesive starts.
  • Broadcast mastic asphalt must be primed with Sika® Primer MR Fast or Sika® Primer MB. For the instructions for use, please refer to the corresponding Product Data Sheet for Sika® Primer MB.
  • Glazed ceramic and old existing ceramic tiles must be degreased and cleaned with Sika® Aktivator-205, or the tile surfaces must be ground and then thoroughly cleaned with an industrial vacuum.
  • For other substrates contact Sika Technical Service for advice and assistance.
  • SikaBond® T-8 can be used without priming on cement based floors, anhydrite floors, chipboards, concrete and ceramic tiles.
  • For broadcasted mastic asphalt, cement based floors with excessive moisture content and use over old adhesive residues or on weak substrates use Sika® Primer MB. For detailed instructions contact Sika Technical Service.

CLEANING OF TOOLS

Clean all tools and application equipment immediately after use with Sika® Remover-208 and/or Sika® TopClean T. Once cured, residual material can only be removed mechanically.

 

Documents